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HSD32M64D16A
Synchronous DRAM Module 256Mbyte (32Mx64bit), DIMM based on16Mx8, 4Banks, 4K Ref., 3.3V Part No. HSD32M64D16A
GENERAL DESCRIPTION
The HSD32M64D16A is a 32M x 64 bit Synchronous Dynamic RAM high-density memory module. The module consists of sixteen CMOS 16M x 8 bit with 4banks Synchronous DRAMs in TSOP-II 400mil packages and 2K EEPROM in 8-pin TSSOP package on a 168-pin glass-epoxy. Two 0.1uF-decoupling capacitors are mounted on the printed circuit board in parallel for each SDRAM. The HSD32M64D16A is a DIMM (Dual in line Memory Module) and is intended for mounting into 168-pin edge connector sockets. Synchronous design allows precise cycle control with the use of system clock. I/O transactions are possible on every clock cycle. Range of operating frequencies, programmable latencies allows the same device to be useful for a variety of high bandwidth, high performance memory system applications All module components may be powered from a single 3.3V DC power supply and all inputs and outputs are LVTTL-compatible.
FEATURES
* Part Identification
HSD32M64D16A-F/10L : 100MHz (CL=3) HSD32M64D16A-F/10 : 100MHz (CL=2) HSD32M64D16A-F/12 : 125MHz (CL=3) HSD32M64D16A-F/13 : 1335MHz (CL=3) F means Auto & Self refresh with Low-Power (3.3V) * Burst mode operation * Auto & self refresh capability (4096 Cycles/64ms) * LVTTL compatible inputs and outputs * Single 3.3V 0.3V power supply * MRS cycle with address key programs - Latency (Access from column address) - Burst length (1, 2, 4, 8 & Full page) - Data scramble (Sequential & Interleave) * All inputs are sampled at the positive going edge of the system clock * The used device is 4M x 8bit x 4Banks SDRAM
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PIN ASSIGNMENT
PIN 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 Symbol Vss DQ0 DQ1 DQ2 DQ3 Vcc DQ4 DQ5 DQ6 DQ7 DQ8 Vss DQ9 DQ10 DQ11 DQ12 DQ13 Vcc DQ14 DQ15 NC NC Vss NC NC Vcc /WE DQM0 PIN 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 Symbol DQM1 /CE0 NC Vss A0 A2 A4 A6 A8 A10 BA1 Vcc Vcc CLK0 Vss NC /CE2 DQM2 DQM3 NC Vcc NC NC NC NC Vss DQ16 DQ17 PIN 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 Symbol DQ18 DQ19 Vcc DQ20 NC NC CKE1 Vss DQ21 DQ22 DQ23 Vss DQ24 DQ25 DQ26 DQ27 Vcc DQ28 DQ29 DQ30 DQ31 Vss CLK2 NC WP SDA SCL Vcc PIN 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 101 102 103 104 105 106 107 108 109 110 111 112 Symbol Vss DQ32 DQ33 DQ34 DQ35 Vcc DQ36 DQ37 DQ38 DQ39 DQ40 Vss DQ41 DQ42 DQ43 DQ44 DQ45 Vcc DQ46 DQ47 NC NC Vss NC NC Vcc /CAS DQM4 PIN 113 114 115 116 117 118 119 120 121 122 123 124 125 126 127 128 129 130 131 132 133 134 135 136 137 138 139 140
HSD32M64D16A
Symbol DQM5 /CE1 /RAS Vss A1 A3 A5 A7 A9 BA0 A11 Vcc CLK1 NC Vss CKE0 /CE3 DQM6 DQM7 NC Vcc NC NC NC NC Vss DQ48 DQ49
PIN 141 142 143 144 145 146 147 148 149 150 151 152 153 154 155 156 157 158 159 160 161 162 163 164 165 166 167 168
Symbol DQ50 DQ51 Vcc DQ52 NC NC NC Vss DQ53 DQ54 DQ55 Vss DQ56 DQ57 DQ58 DQ59 Vcc DQ60 DQ61 DQ62 DQ63 Vss CLK3 NC SA0 SA1 SA2 Vcc
* These pins are not used in this module *Pin Names VREF : Power supply for reference CLK0 ~ CLK3 : Clock input CKE0 ~ CKE1 : Colck enable input /CE0 ~ /CE3 : Chip enable input Vcc : Power supply Vss : Ground SDA : Serial data I/O SCL : Serial clock SA0 ~ 2 : Address in EEPROM
** These pins should be NC in the system which does not support SPD
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FUNCTIONAL BLOCK DIAGRAM
HSD32M64D16A
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PIN FUNCTION DESCRIPTION
Pin CLK /CE Name System clock Chip enable Input Function Active on the positive going edge to sample all inputs.
HSD32M64D16A
Disables or enables device operation by masking or enabling all inputs except CLK, CKE and DQM
CKE
Clock enable
Masks system clock to freeze operation from the next clock cycle. CKE should be enabled at least one cycle prior to new command. Disable input buffers for power down in standby. CKE should be enabled 1CLK+tSS prior to valid command.
A0 ~ A11
Address
Row/column addresses are multiplexed on the same pins. Row address : RA0 ~ RA11, Column address : CA0 ~ CA9
BA0 ~ BA1
Bank select address
Selects bank to be activated during row address latch time. Selects bank for read/write during column address latch time.
/RAS
Row address strobe
Latches row addresses on the positive going edge of the CLK with RAS low. Enables row access & precharge.
/CAS
Column address strobe
Latches column addresses on the positive going edge of the CLK with CAS low. Enables column access.
/WE
Write enable
Enables write operation and row precharge. Latches data in starting from CAS, WE active.
DQM0 ~ 7
Data input/output mask
Makes data output Hi-Z, tSHZ after the clock and masks the output. Blocks data input when DQM active. (Byte masking)
DQ0 ~ 63 Vcc/Vss
Data input/output Power supply/ground
Data inputs/outputs are multiplexed on the same pins. Power and ground for the input buffers and the core logic.
ABSOLUTE MAXIMUM RATINGS
PARAMETER Voltage on Any Pin Relative to Vss Voltage on Vcc Supply Relative to Vss Power Dissipation Storage Temperature SYMBOL VIN ,OUT Vcc PD TSTG RATING -1V to 4.6V -1V to 4.6V 16W -55oC to 150oC
Short Circuit Output Current IOS 50mA Notes: Permanent device damage may occur if " Absolute Maximum Ratings" are exceeded. Functional operation should be restricted to the conditions as detailed in the operational sections of this data sheet. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
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HSD32M64D16A
DC OPERATING CONDITIONS
(Recommended operating conditions (Voltage referenced to VSS = 0V, TA = 0 to 70 C) ) PARAMETER Supply Voltage Input High Voltage Input Low Voltage Output High Voltage Output Low Voltage SYMBOL Vcc VIH VIL VOH VOL MIN 3.0 2.0 -0.3 2.4 TYP. 3.3 3.0 0 MAX 3.6 Vcc+0.3 0.8 0.4 UNIT V V V V V 1 2 IOH = -2mA IOL = 2mA 3 NOTE
Input leakage current I LI -10 10 uA Notes : 1. VIH (max) = 5.6V AC. The overshoot voltage duration is 3ns. 2. VIL (min) = -2.0V AC. The undershoot voltage duration is 3ns. 3. Any input 0V VIN VDDQ. Input leakage currents include Hi-Z output leakage for all bi-directional buffers with Tri-State outputs.
CAPACITANCE
(VCC = 3.3V, TA = 23 C, f = 1MHz, VREF =1.4V 200 mV) DESCRIPTION Clock /RAS, /CAS,/WE,/CE, CKE, DQM Address DQ (DQ0 ~ DQ7) SYMBOL CCLK CIN CADD COUT MIN 18 50 50 13 MAX 25 95 95 18 UNITS pF pF pF pF
DC CHARACTERISTICS
(Recommended operating condition unless otherwise noted, TA = 0 to 70 C) TEST PARAMETER SYMBOL CONDITION Burst length = 1 Operating current ICC1 (One bank active) tRC tRC(min) IO = 0mA Precharge standby current in power-down mode Precharge standby current in ICC2N non power-down mode ICC2PS ICC2P CKE VIL(max) tCC=10ns CKE & CLK VIL(max) tCC= CKE VIH(min) CS* VIH(min), tCC=10ns Input signals are changed one time during 20ns 320 mA 16 mA 16 mA 1920 1920 1760 1760 mA 1 -13 -12 -10 10L VERSION UNIT NOTE
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CKE VIH(min) ICC2NS CLK VIL(max), tCC= Input signals are stable Active standby current in powerICC3PS down mode Active standby current in non power-down mode (One bank active) Operating current ICC4 (Burst mode) tCCD = 2CLKs Refresh current Self refresh current ICC5 ICC6 tRC tRC(min) CKE 0.2V 3520 3520 24 12.8 Notes: 1. Measured with outputs open. 2. Refresh period is 64ms. 3. Unless otherwise noticed, input swing level is CMOS(VIH/VIL=VDDQ/VSSQ). 4Banks Activated 2400 2320 ICC3NS ICC3N ICC3P CKE VIL(max), tCC=10ns CKE&CLK VIL(max) tCC= CKEVIH(min), CS*VIH(min) tCC=10ns Input signals are changed one time during 20ns CKEVIH(min) CLK VIL(max) tCC= Input signals are stable IO = 0 mA Page burst 320 480 80 112
HSD32M64D16A
mA 80
mA
2000
2000
mA
1
3360
3360
mA mA mA
2
AC OPERATING TEST CONDITIONS
(vcc = 3.3V 0.3V, TA = 0 to 70 C) PARAMETER AC Input levels (Vih/Vil) Input timing measurement reference level Input rise and fall time Output timing measurement reference level Output load condition Value 2.4/0.4 1.4 tr/tf = 1/1 1.4 See Fig. 2 UNIT V V ns V
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HSD32M64D16A
+3.3V
Vtt=1.4V
1200 DOUT 870 50pF* VOH (DC) = 2.4V, IOH = -2mA VOL (DC) = 0.4V, IOL = 2mA (Fig. 1) DC output load circuit DOUT Z0=50
50 50pF
(Fig. 2) AC output load circuit
OPERATING AC PARAMETER
(AC operating conditions unless otherwise noted) VERSION PARAMETER Row active to row active delay RAS to CAS delay Row precharge time Row active time Row cycle time Last data in to row precharge Last data in to Active delay Last data in to new col. address delay Last data in to burst stop Col. address to col. address delay Number of valid output data CAS latency=2 1 SYMBOL -13 tRRD(min) tRP(min) tRP(min) tRAS(min) tRAS(max)
tRC(min)
UNIT -12 16 20 20 48 100 65 68 2 2 CLK + 20 ns 1 1 1 2 ea 70 70 -10 20 20 20 50 -10L 20 20 20 50 ns ns ns ns ns ns CLK CLK CLK CLK 15 20 20 45
NOTE 1 1 1 1
1 2
tRDL(min) tDAL(min) tCDL(min) tBDL(min) tCCD(min) CAS latency=3
2 2 3 4
Notes : 1. The minimum number of clock cycles is determined by dividing the minimum time required with clock cycle time and then rounding off to the next higher integer. 2. Minimum delay is required to complete write. 3. All parts allow every cycle column address change. 4. In case of row precharge interrupt, auto precharge and read burst stop. .5. For -8/H/L/10, tRDL=1CLK and tDAL=1CLK+20ns is also supported . ( recommend : tRDL=2CLK and tDAL=2CLK + 20ns.)
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AC CHARACTERISTICS
(AC operating conditions unless otherwise noted) -13 PARAMETER CLK cycle time CAS 7.5 latency=3 tCC CAS latency=2 CLK to valid output delay CAS 5.4 latency=3 tSAC CAS latency=2 Output data hold time CAS 2.7 latency=3 tOH CAS latency=2 CLK high pulse width CLK low pulse width Input setup time Input hold time CLK to output in Low-Z CLK to output in Hi-Z CAS 5.4 latency=3 tSHZ CAS latency=2 Notes : 1. Parameters depend on programmed CAS latency. 2. If clock rising time is longer than 1ns, (tr/2-0.5)ns should be added to the parameter. 3. Assumed input rise and fall time (tr & tf) = 1ns. If tr & tf is longer than 1ns, transient time compensation should be considered ie., [(tr + tf)/2-1]ns should be added to the parameter. 6 6 6 tCH tCL tSS tSH tSLZ 2.5 2.5 1.5 0.8 1 3 3 2 1 1 3 3 2 1 1 3 3 2 1 1 3 3 3 3 3 6 6 6 10 12 1000 1000 1000 8 10 10 SYMBOL MIN MAX MIN MAX MIN MAX MIN -12 -10
HSD32M64D16A
-10L UNIT MAX NOTE
1000
ns
1
6 ns 7 1,2
ns
2
ns ns ns ns ns 6 ns
3 3 3 3 3 2
7
ns
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SIMPLIFIED TRUTH TABLE
COMMAND Register Mode register set Auto refresh Refresh Self refres h Auto disable Auto disable Auto disable Auto disable Burst Stop Precharg e Bank selection All banks Entry Exit Entry Exit H H H L H L H H X H L X X L H L H L L H L X H L H L L L X V X X H X V X X H X H X H H H X V X X H X V L L X V X X H X V X X X X X V X precharge precharge H X L H L L X V precharge Entry Exit CKE n-1 H H L H CKE n X H L H X /C E L L L H L /R A S L L H X L /C A S L L H X H /W E L H H X H D Q M X X X X V BA 0,1
HSD32M64D16A
A10/ AP OP code X X
A11 A9~A0
NOTE 1,2 3 3 3 3
Bank active & row addr. Read & column address precharge
Row address L Column Address H (A0 ~ A9) Column L Address (A0 ~ A9) H X L H X X 4,5 6 4 4,5 4
H
X
L
H
L
H
X
V
Write & column address
Clock suspend or active power down
Precharge down mode DQM
power
X X V X X X 7
No operation command
(V=Valid, X=Don't care, H=Logic high, L=Logic low) Notes : 1. OP Code : Operand code A0 ~ A11 & BA0 ~ BA1 : Program keys. (@ MRS) 2. MRS can be issued only at all banks precharge state. A new command can be issued after 2 CLK cycles of MRS. 3. Auto refresh functions are as same as CBR refresh of DRAM. The automatical precharge without row precharge command is meant by "Auto". Auto/self refresh can be issued only at all banks precharge state. 4. BA0 ~ BA1 : Bank select addresses. If both BA0 and BA1 are "Low" at read, write, row active and precharge, bank A is selected. If both BA0 is "Low" and BA1 is "High" at read, write, row active and precharge, bank B is selected. If both BA0 is "High" and BA1 is "Low" at read, write, row active and precharge, bank C is selected. If both BA0 and BA1 are "High" at read, write, row active and precharge, bank D is selected. If A10/AP is "High" at row precharge, BA0 and BA1 is ignored and all banks are selected. 5. During burst read or write with auto precharge, new read/write command can not be issued. Another bank read/write command can be issued after the end of burst. New row active of the associated bank can be issued at tRP after the end of burst. 6. Burst stop command is valid at every burst length. 7. DQM sampled at positive going edge of a CLK and masks the data-in at the very CLK (Write DQM latency is 0), but makes Hi-Z state the data-out of 2 CLK cycles after. (Read DQM latency is 2)
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HSD32M64D16A
PACKAGING INFORMATION
Unit : inch [mm] Tolerance : 0.008 [ 0.20 ]
PCB Thickness
:
1.27 0.08
ORDERING INFORMATION
Part Number Density Org. Package Ref. Vcc MODE MAX.frq CL3 133MHz CL3 125MHz CL3 100MHz CL2 100MHz CL3 133MHz CL3 125MHz CL3 100MHz CL2 100MHz
HSD32M64D16A-13 HSD32M64D16A-12 HSD32M64D16A-10L HSD32M64D16A-10 HSD32M64D16A-F13 HSD32M64D16A-F12 HSD32M64D16A-F10L HSD32M64D16A-F10
256MByte 256MByte 256MByte 256MByte 256MByte 256MByte 256MByte 256MByte
32M x 64 32M x 64 32M x 64 32M x 64 32M x 64 32M x 64 32M x 64 32M x 64
168 Pin-DIMM 168 Pin-DIMM 168 Pin-DIMM 168 Pin-DIMM 168 Pin-DIMM 168 Pin-DIMM 168 Pin-DIMM 168 Pin-DIMM
4K 4K 4K 4K 4K 4K 4K 4K
3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V 3.3V
Unbuffered Unbuffered Unbuffered Unbuffered Unbuffered Unbuffered Unbuffered Unbuffered
F means Auto & Self refresh with Low-Power (3.3V)
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